Electronic Component Adhesives Guide

Electronic component adhesives provide the foundation to securely adhere discrete devices to various substrates. While commonly utilized for surface mounting parts onto printed circuit boards (PCBs), adhesives also serve a multitude of other uses including potting/encapsulation/substrate assembly/electronic repairs/potting applications and repairs to electronic systems. This guide presents everything design engineers should know when selecting electronic […]

Epoxy resin 5050AB is specially used for machine filling, electronic component packaging, power package, mold filling

Consumer Electronics Assembly Adhesive Glue

Within the dynamic world of consumer electronics, assembly processes play an integral part in their durability and functionality. Each device relies on high-grade assembly materials including adhesives that contribute to durability and functionality – from smartphones and tablets through laptops and wearables – including smartphones themselves rely on them heavily as bonding agents; consumer electronics […]

What is the best way to adjust epoxy adhesive viscosity?

You can adjust the viscosity to meet different requirements. These are some of the most common ways: The viscosity of epoxy adhesives is correlated with the temperature. Temperature increases tend to increase flowability and decrease viscosity. Heating the adhesive will reduce its viscosity. To prevent premature cure or degradation, the temperature must be carefully controlled during heating. Lowering the temperature […]

The bonding glue cures in five minutes

Before using epoxy resin AB glue, it is vital that users understand its composition, application techniques and curing properties.

Epoxy resin AB glue is an indispensable material when it comes to adhesive solutions, consisting of two distinct components – resin (A) and hardener (B). When mixed together they form an exceptionally strong and long-term bond, making this adhesive suitable for various applications. By understanding their respective properties and interaction during curing processes users can […]

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